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Wet Station TH200

Wet Station TH200

Best customized device provided by the well experiences in the diverse fields.

Features

Flexible support for your requests with our accumulated experience and reliable performance.

  • Reliable performance in the diverse industries including semiconductors, MEMS, Solar Cell, and chemical compound.
  • Customization based on our experience accumulated for a harl century to provide you the best suitable devices that meet your needs.

High Process Performance

  • Uniform circulation is achieved with the best simplified processing tank structure and our originally developed optimum circulation supply nozzles.
  • On the basis of our high Fluoropolymer processing technologies and knowledge on Fluoropolymer characteristics, generation of particles and contamination are properly controlled by selecting and processing optimum parts and materials.
  • Higher uniformity of temperature, higher uniformity of circulation, higher etching rate, and higher uniformity of etching are achieved.
  • Available for a higher level cleaning process brought by Vapor-less type IPA replacement dryer that achieved water-mark less drying.

Realizing high throughput

  • High speed and stable transfer enabled by servo motor control.
  • Control system for the transter between the tanks in the shortest time by making the distance shortest to eliminate the wasted time

Improvement in the maintenance performance

  • Part arrangement taking account of the maintenance performance
  • Equipped with a control system to minimize the down-time due to liquid replacement

Consideration to safety

  • Safety design in accordance with SEMI standard.
  • A seismic stress to the device is simulated and fed back to the design.

Device design based on the rich experimental data

  • The processing tank is designed on the basis of the fluid analysis, and the improvement of uniformity and shortening the resistance recovery time ratio are achieved.
  • Any desired process of customers can be executed by using in-house experimental facility. The experiment results are reflected to device designing to provide optimum devices.

Specifications

Types Batch dip type cleaning equipment
Objected product LSI, discrete, MEMS, LED, and powerIC
Correspondent wafer ⁄ work ø150~ø200mm
Correspondent work thickness 725µm
Clean level Not more than 30 particles in size of 0.16µm or more
Processing method Carrier transfer, Carrier-less transfer, and half pitch processing
Processing unit 25 pieces and 50 pieces
Dry method TMD, S ⁄ D, and Hot-air drying is available.
Option Density management for * SECS I and Ⅱ for OHT and for ON-LINE, HSMS, and GEM

Correspondent process

  • RCA cleaning
  • Particle removal
  • Nitride film removal
  • Oxide film removal
  • Polymer removal
  • Resist Strip Station
  • Silicon Etching
  • Sacrificial Layer Etching
  • Metal Etching
  • Developing

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